2025 Intern - Packaging Engineer
NXP Semiconductors(7 months ago)
About this role
A packaging back-end R&D intern role focused on integrated circuit (IC) packaging technology research and development. The position supports global development projects at NXP Greater China and involves collaboration with international teams to advance packaging processes and materials.
Required Skills
- Packaging Technology
- Process Development
- Material Interface
- Failure Analysis
- Project Leadership
- Cross-Functional Communication
- Independent Research
- English Proficiency
Qualifications
- Pursuing Master's Degree
- Major: Metallic Materials Engineering
- Major: Polymer Materials Engineering
- Major: Mechanical Engineering and Automation
- CET-4
- CET-6 (Preferred)
About NXP Semiconductors
nxp.comNXP is a global semiconductor company creating solutions that enable secure connections for a smarter world.
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