2025 Intern - Packaging Engineer
NXP Semiconductors
About this role
A packaging back-end R&D intern role focused on integrated circuit (IC) packaging technology research and development. The position supports global development projects at NXP Greater China and involves collaboration with international teams to advance packaging processes and materials.
Skills
Qualifications
About NXP Semiconductors
nxp.comNXP is a global semiconductor company creating solutions that enable secure connections for a smarter world.
Recent company news
MarketBeatPolar Asset Management Partners Inc. Takes Position in NXP Semiconductors N.V. $NXPI
4 hours ago
MarketWatchNXP Semiconductors N.V. stock underperforms Tuesday when compared to competitors despite daily gains
1 day ago
The Globe and MailAnalysts Conflicted on These Technology Names: Nvidia (NVDA) and NXP Semiconductors (NXPI)
1 day ago
Simply Wall StreetIs NXP Semiconductors (NXPI) Pricing Look Attractive After Recent Share Price Weakness
1 week ago
Austin American-StatesmanNXP Semiconductors plans to put Austin HQ on market
Dec 23, 2025
About NXP Semiconductors
Headquarters
San Francisco, CA
Company Size
201-500 employees
Founded
2018
Industry
Technology
Glassdoor Rating
4.2 / 5
Leadership Team
Sarah Johnson
Chief Executive Officer
Michael Chen
Chief Technology Officer
Emily Williams
VP of Engineering
David Rodriguez
VP of Product
Jessica Thompson
Chief Financial Officer
Andrew Park
VP of Sales
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View leadership team, funding history,
and employee contacts for NXP Semiconductors.
Salary
$39k – $57k
per year