2026 Summer - ALD Process Development Engineer Intern - MS/PhD (Detroit, MI)
Applied Materials(21 days ago)
About this role
Process Engineer Intern at Applied Materials working at the company’s Wayne State University facility on thin film deposition process technology as part of an industrial/academic collaboration. This is a full-time, 12-week in-office internship (May/June–Aug/Sept 2026) within the materials engineering/R&D organization supporting semiconductor and display manufacturing efforts. The role sits within Applied’s engineering group focused on advancing materials and process solutions.
Required Skills
- Vapor Deposition
- Atomic Layer Deposition
- Thin Films
- Electron Microscopy
- XPS
- XRD
- XRF
- TEM
- FTIR
- Data Analysis
+3 more
Qualifications
- MS or PhD in Material Science or Chemical Engineering
About Applied Materials
appliedmaterials.comApplied Materials is a global leader in materials engineering solutions that enable the production of virtually every new semiconductor chip and advanced display. The company designs, manufactures and services equipment, software and process technologies across semiconductor fabrication (deposition, etch, implantation, inspection/metrology, CMP, ALD/CVD/PVD), advanced packaging and display manufacturing. Its customers include chipmakers, foundries and display manufacturers worldwide, and it provides process integration, factory automation and lifecycle services to improve yield, performance and cost. Headquartered in Santa Clara, California, Applied Materials combines deep R&D and scale to drive device scaling, energy efficiency and new architectures.
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