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© All Rights Reserved. ApplyBlast.com
marvellsemiconductor.com
This senior R&D role leads the Advanced Packaging team at Marvell, designing next-generation 2.5D and 3D package architectures for AI, HPC, and networking solutions. The incumbent defines package roadmaps, drives co-design efforts with silicon teams, and manages technology validation with OSATs and foundry partners to ensure manufacturability and reliability. Key focus areas include signal and power integrity, thermal management, and developing innovative substrates and interposers for high-performance computing applications.
Headquarters
Santa Clara, California, United States
Company Size
1001-5000 employees
Headquarters
San Francisco, CA
Company Size
201-500 employees
Founded
2018
Industry
Technology
Glassdoor Rating
4.2 / 5
Sarah Johnson
Chief Executive Officer
Michael Chen
Chief Technology Officer
Emily Williams
VP of Engineering
David Rodriguez
VP of Product
Jessica Thompson
Chief Financial Officer
Andrew Park
VP of Sales
View leadership team, funding history,
and employee contacts for marvellsemiconductor.com.
104% above the average for this role
Advanced Package Technology, Principal Engineer
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