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Advanced Packaging Cryogenic Modeling Engineer at GlobalFoundries - ApplyBlast

Advanced Packaging Cryogenic Modeling Engineer

GlobalFoundries

5 months ago

3.5 on Glassdoor

Essex Junction, VT

Hybrid

Full Time

Senior

0 applicants

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About this role

GlobalFoundries is seeking an experienced thermal, mechanical, and/or electrical modeler to support cryogenic packaging and system co-optimization R&D. The engineer will use multi-physics tools to build models capturing low-temperature material properties and thermo-mechanical effects for advanced packaging optimization. This role involves collaborating with integration and device teams to identify critical process interactions and drive optimal 3DHI technology decisions.

Responsibilities

Develop and correlate cryogenic models for semiconductor devices and advanced packages
Perform stress simulations for continuous and discontinuous active areas
Anticipate integration or process issues based on team input
Facilitate discussions with originating teams to identify critical process interactions
Apply commercial simulation software to mimic cryogenic semiconductor process flows

Skills

Qualifications

M.S. degree10 years experienceAnsys certification preferred

About GlobalFoundries

gf.com

Headquarters

Malta, New York, United States

Company Size

10001+ employees

Founded

2009

View Profile

GlobalFoundries is a leading semiconductor manufacturing firm that specializes in providing advanced technology solutions to a global clientele. The company facilitates seamless collaboration through its GF Connect platform, allowing customers to manage orders and get to production more efficiently. With a commitment to innovation and quality, GlobalFoundries plays a crucial role in the semiconductor supply chain, delivering cutting-edge manufacturing capabilities for various industries.