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© All Rights Reserved. ApplyBlast.com
marvellsemiconductor.com
As an Advanced Packaging Design Engineer at Marvell, you will design and develop packages for high-performance computing, AI, and networking solutions using tools like APD or Xpedition. The role involves creating multi-chip configurations with 2.5D and 3D packages while managing routing for high-speed interfaces such as HBM, DDR, and SERDES. You will collaborate with global engineering teams to optimize signal integrity and address complex substrate and PCB layout challenges.
Headquarters
Santa Clara, California, United States
Company Size
1001-5000 employees
Headquarters
San Francisco, CA
Company Size
201-500 employees
Founded
2018
Industry
Technology
Glassdoor Rating
4.2 / 5
Sarah Johnson
Chief Executive Officer
Michael Chen
Chief Technology Officer
Emily Williams
VP of Engineering
David Rodriguez
VP of Product
Jessica Thompson
Chief Financial Officer
Andrew Park
VP of Sales
View leadership team, funding history,
and employee contacts for marvellsemiconductor.com.
31% above the average for this role