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© All Rights Reserved. ApplyBlast.com
SkyWater Technology Foundry, Inc.
The Advanced Packaging Process Integration Engineer - Principal leads the development and integration of novel semiconductor packaging technologies, including Si interposers, FanOut, and hybrid bonding, to transition client concepts from proof of concept to volume manufacturing. This role involves creating comprehensive process flows, optimizing recipes, and collaborating with cross-functional teams to ensure high yield and product qualification. The position requires strong problem-solving skills and the ability to communicate effectively with foundry customers and internal stakeholders.
Headquarters
Bloomington, Minnesota, United States
Company Size
501-1000 employees
Founded
2017
SkyWater Technology is a U.S.-based, solely U.S.-owned, DMEA‑accredited pure‑play semiconductor foundry. The company provides advanced innovation engineering services and volume manufacturing for a wide variety of differentiated integrated circuits (ICs), supporting commercial and defense customers. SkyWater emphasizes secure domestic supply and offers turnkey capabilities from design and prototyping through production. Customers choose it for U.S. ownership, defense-grade accreditation, and specialized foundry expertise.
Headquarters
San Francisco, CA
Company Size
201-500 employees
Founded
2018
Industry
Technology
Glassdoor Rating
4.2 / 5
Sarah Johnson
Chief Executive Officer
Michael Chen
Chief Technology Officer
Emily Williams
VP of Engineering
David Rodriguez
VP of Product
Jessica Thompson
Chief Financial Officer
Andrew Park
VP of Sales
View leadership team, funding history,
and employee contacts for SkyWater Technology Foundry, Inc..
SkyWater Technology Foundry, Inc. didn’t post a salary, so this is our estimate from similar listings.
46% above the average for this role
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