Applied Materials
A Process Support Engineer at Applied Materials provides on-site technical support for KINEX bonding equipment in advanced semiconductor packaging environments. The role focuses on die-to-wafer bonding technologies, involving installation, troubleshooting, process stabilization, and executing design of experiments. Engineers act as process owners for hybrid bonding technologies, collaborating with customers to ensure stable production and yield improvement in high-volume manufacturing.
Headquarters
Santa Clara, California, United States
Company Size
10001+ employees
Founded
1967
Applied Materials is a global leader in materials engineering solutions that enable the production of virtually every new semiconductor chip and advanced display. The company designs, manufactures and services equipment, software and process technologies across semiconductor fabrication (deposition, etch, implantation, inspection/metrology, CMP, ALD/CVD/PVD), advanced packaging and display manufacturing. Its customers include chipmakers, foundries and display manufacturers worldwide, and it provides process integration, factory automation and lifecycle services to improve yield, performance and cost. Headquartered in Santa Clara, California, Applied Materials combines deep R&D and scale to drive device scaling, energy efficiency and new architectures.
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Headquarters
San Francisco, CA
Company Size
201-500 employees
Founded
2018
Industry
Technology
Glassdoor Rating
4.2 / 5
Sarah Johnson
Chief Executive Officer
Michael Chen
Chief Technology Officer
Emily Williams
VP of Engineering
David Rodriguez
VP of Product
Jessica Thompson
Chief Financial Officer
Andrew Park
VP of Sales
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and employee contacts for Applied Materials.
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