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onsemi
The Advanced Packaging Team Member manages image sensor packaging technology development, process improvement, and new product introduction for automotive, industrial, and consumer applications. The role involves collaborating with corporate business units, design engineering, and external suppliers to develop analytical techniques and evaluate new package designs. The position requires expertise in semiconductor assembly packaging, statistical analysis, and project management.
The leader in intelligent power and image sensing technologies that build a better future for the automotive, industrial, cloud, medical, and IoT markets
Headquarters
San Francisco, CA
Company Size
201-500 employees
Founded
2018
Industry
Technology
Glassdoor Rating
4.2 / 5
Sarah Johnson
Chief Executive Officer
Michael Chen
Chief Technology Officer
Emily Williams
VP of Engineering
David Rodriguez
VP of Product
Jessica Thompson
Chief Financial Officer
Andrew Park
VP of Sales
View leadership team, funding history,
and employee contacts for onsemi.
onsemi didn’t post a salary, so this is our estimate from similar listings.