Assembly Engineering Lead
NXP Semiconductors(2 months ago)
About this role
A Process Engineering Manager at NXP responsible for driving process capability and strategy across wafer-to-package semiconductor assembly operations. The role focuses on establishing long-term process roadmaps, ensuring manufacturing continuity and enabling successful new product/technology introductions. It requires deep packaging experience and collaboration with cross-functional teams to sustain talent, best practices and supplier readiness.
Required Skills
- Process Standardization
- Capability Roadmap
- Risk Assessment
- Process Optimization
- Supplier Sourcing
- Equipment Benchmarking
- NPI Management
- Wire Bonding
- Package Development
- Leadership
+3 more
Qualifications
- Bachelor's Degree in Engineering
- Problem Solving Certification
- 8D
- 3x5 Whys
About NXP Semiconductors
nxp.comNXP is a global semiconductor company creating solutions that enable secure connections for a smarter world.
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