Assembly Media and Collaterals Development Engineer
Intel(1 month ago)
About this role
This role at Intel Foundry in Kulim, Malaysia focuses on advancing semiconductor assembly and packaging platform technologies for future product roadmaps. It is an experienced engineering position supporting manufacturing and qualification of package technologies within a worldwide factory network. The job operates on Shift 1 and requires an on-site presence.
Required Skills
- Semiconductor Packaging
- Process Development
- Equipment Development
- Process Optimization
- Manufacturing Engineering
- Statistical Process Control
- Design Of Experiments
- Data Analysis
- AutoCAD
- SolidWorks
+6 more
Qualifications
- BS in Mechanical Engineering
- BS in Materials Engineering
- BS in Electrical Engineering
- BS in Physics
- MS in Mechanical Engineering
- MS in Materials Engineering
- MS in Electrical Engineering
- MS in Physics
About Intel
intel.comIntel Corporation is a global technology company that designs and manufactures advanced integrated digital technology products, including microprocessors, chipsets, and software solutions. With a focus on delivering Artificial Intelligence (AI) at scale, Intel provides comprehensive hardware and software solutions for cloud, data center, edge computing, and client devices. The company is known for its innovation in technologies that power a variety of computing platforms, from personal computers to enterprise solutions, enabling businesses and individuals to realize their full potential.
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