Assembly Process & NPI Engineer
Broadcom(1 month ago)
About this role
This position at Broadcom focuses on oversight of silicon bumping and advanced package assembly supply chains and backend processes for advanced-node semiconductor products. The role supports new product and technology introductions and drives continual improvement, second sourcing, and cost reduction across suppliers and internal teams.
Required Skills
- Silicon Bumping
- Package Assembly
- Supplier Management
- Process Improvement
- NPI
- Product Lifecycle
- BOM Management
- Process Documentation
- Failure Analysis
- TQM
+6 more
Qualifications
- PhD in Engineering
- Master's Degree in Engineering
- Bachelor's Degree in Mechanical Engineering
- Bachelor's Degree in Electrical Engineering
- Bachelor's Degree in Electronics Engineering
About Broadcom
broadcom.comBroadcom Inc. is a global technology leader that designs, develops, and supplies a comprehensive range of semiconductor and enterprise software solutions. The company's offerings include a variety of security solutions and products aimed at enhancing connectivity across various sectors. With a commitment to innovation and quality, Broadcom is at the forefront of driving technological advancements that connect everything, from data centers to mobile devices.
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