The Bountiful Company
The Associate R&D Specialist Packaging - Material Characterization will support packaging project managers by characterizing mechanical, thermal, and gas‑barrier properties of coffee packaging materials. The role involves developing and digitalizing advanced characterization tools, building material knowledge, and contributing to design of experiments and IP protection within Nestlé's Product Technology Centre Coffee.
Nestlé is a Swiss multinational food and beverage company and one of the world’s largest consumer goods firms, producing and selling products across categories such as coffee, dairy, infant nutrition, petcare, confectionery, bottled water and prepared foods. It owns many well‑known global brands (e.g., Nescafé, Nespresso, KitKat, Purina, Gerber) and operates an extensive network of regional subsidiaries, factories and sales channels serving consumers worldwide. The company emphasizes nutrition, health and wellness in product development and invests heavily in R&D and specialized nutrition businesses. Nestlé also pursues sustainability and responsible‑sourcing initiatives across its supply chain, including efforts on packaging, water stewardship and emissions reduction.
Headquarters
San Francisco, CA
Company Size
201-500 employees
Founded
2018
Industry
Technology
Glassdoor Rating
4.2 / 5
Sarah Johnson
Chief Executive Officer
Michael Chen
Chief Technology Officer
Emily Williams
VP of Engineering
David Rodriguez
VP of Product
Jessica Thompson
Chief Financial Officer
Andrew Park
VP of Sales
View leadership team, funding history,
and employee contacts for The Bountiful Company.
The Bountiful Company didn’t post a salary, so this is our estimate from similar listings.
Associate R&D Specialist Packaging - Material Characterization
DeKalb County Government
Polymer Mechanics & Characterization Specialist
3M
Research Scientist in Advanced Material Characterization, Application and Modeling
Hitachi Energy
Sr. Materials Characterization Scientist
E Ink Holdings
Material Engineer
Bosch Group
Electrical and Material Characterization of DS7409KNF New Low Loss Core Material for Radar Applications
NXP Semiconductors