Bonding Process Control Engineer

The Bonding Process Control Engineer is responsible for owning, optimizing, and sustaining wafer-level bonding processes, including hybrid wafer-to-wafer, chip-to-wafer, and Temporary Bonding & Debonding (TBDB). This role focuses on process stability, SPC governance, yield improvement, and defect reduction to enable next-generation heterogeneous integration and advanced packaging technologies. The engineer will drive process robustness and manufacturability across multiple toolsets and wafer sizes.