Buffered Oxide Etch Wafer Process Owner

The Buffered Oxide Etch Wafer Process Owner is responsible for owning and optimizing the BOE wet etch process to ensure precise, uniform, and repeatable oxide removal for wafer patterning and oxide opening applications. This role supports accurate pattern transfer, high device quality, and strong manufacturing yield through process stability and continuous improvement. The position involves collaborating with cross-functional teams to troubleshoot excursions, conduct root cause analysis, and drive process capability enhancements.