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Cmp Module Process Engineer Iv E4 Boise Id at Applied Materials - ApplyBlast

Cmp Module Process Engineer Iv E4 Boise Id

Applied Materials

4 months ago

3.9 on Glassdoor

United States of America

Onsite

Full Time

Senior

0 applicants

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About this role

A Senior CMP Process Expert at Applied Materials provides technical leadership in CMP processes and wafer fab operations, identifies and resolves complex process issues, and drives continuous improvement through data analytics and customer collaboration.

Responsibilities

Lead discussions with customers to identify and solve complex CMP process issues
Drive continuous improvement through data analytics and process optimization
Mentor junior level MPE's and provide technical leadership
Resolve complex tool issues using analytics and systematic troubleshooting methodologies
Identify opportunities for service renewal, upsell, and penetration
Implement new service technologies through demos and joint development programs
Contribute to CMP network of experts and community of practice

Skills

Qualifications

BS - Engineering10+ years CMP ProcessWafer Fab Process / Equipment experienceTechnical ExpertiseCommunication Skills

About Applied Materials

appliedmaterials.com

Headquarters

Santa Clara, California, United States

Company Size

10001+ employees

Founded

1967

View Profile

Applied Materials is a global leader in materials engineering solutions that enable the production of virtually every new semiconductor chip and advanced display. The company designs, manufactures and services equipment, software and process technologies across semiconductor fabrication (deposition, etch, implantation, inspection/metrology, CMP, ALD/CVD/PVD), advanced packaging and display manufacturing. Its customers include chipmakers, foundries and display manufacturers worldwide, and it provides process integration, factory automation and lifecycle services to improve yield, performance and cost. Headquartered in Santa Clara, California, Applied Materials combines deep R&D and scale to drive device scaling, energy efficiency and new architectures.