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CMP Module Process Engineer IV - (E4) at Applied Materials - ApplyBlast

CMP Module Process Engineer IV - (E4)

Applied Materials

5 months ago

3.9 on Glassdoor

Santa Clara, CA

Onsite

Full Time

Senior

0 applicants

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About this role

This role is a senior technical expert position focused on Chemical Mechanical Planarization (CMP) processes within the semiconductor manufacturing industry. The incumbent will lead high-value customer engagements, drive continuous improvement projects, and perform complex data analytics to solve yield and integration problems. Success in this position requires deep domain knowledge and the ability to mentor junior engineers while delivering innovative material solutions.

Responsibilities

Lead discussions with customers to understand high-value problems and propose solutions.
Perform data analytics to troubleshoot complex CMP process and yield issues.
Drive adoption of new service technologies through demonstrations and joint development programs.
Mentor and lead junior maintenance process engineers.
Identify opportunities for contract renewal, upselling, and market penetration.

Skills

Qualifications

BS in Engineering

About Applied Materials

appliedmaterials.com

Headquarters

Santa Clara, California, United States

Company Size

10001+ employees

Founded

1967

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Applied Materials is a global leader in materials engineering solutions that enable the production of virtually every new semiconductor chip and advanced display. The company designs, manufactures and services equipment, software and process technologies across semiconductor fabrication (deposition, etch, implantation, inspection/metrology, CMP, ALD/CVD/PVD), advanced packaging and display manufacturing. Its customers include chipmakers, foundries and display manufacturers worldwide, and it provides process integration, factory automation and lifecycle services to improve yield, performance and cost. Headquartered in Santa Clara, California, Applied Materials combines deep R&D and scale to drive device scaling, energy efficiency and new architectures.