HP
The College Intern - Process and Digitalization role at HP involves collaborating with engineering teams to develop manufacturing solutions using AI, IIoT, and automation technologies. The intern will work with high-precision semiconductor packaging tools and participate in projects focused on production, sustainability, and new product introduction. This position aims to build smart factory solutions to enhance manufacturing quality and future-proof operations.
Learn about HP laptops, pc desktops, printers, accessories and more at the Official HP® Website.
Headquarters
San Francisco, CA
Company Size
201-500 employees
Founded
2018
Industry
Technology
Glassdoor Rating
4.2 / 5
Sarah Johnson
Chief Executive Officer
Michael Chen
Chief Technology Officer
Emily Williams
VP of Engineering
David Rodriguez
VP of Product
Jessica Thompson
Chief Financial Officer
Andrew Park
VP of Sales
View leadership team, funding history,
and employee contacts for HP.
HP didn’t post a salary, so this is our estimate from similar listings.
Nov 25, 2025
Extracurricular Internship: Industry 4.0, IIoT and Manufacturing Digitalization (f/m/div.)
Bosch Group
Extracurricular Internship: Industry 4.0, IIoT and Manufacturing Digitalization (f/m/div.)
Bosch Group
Co-op
RTX
Manufacturing Digitalization & Automation Engineer
Hitachi
Co-op
RTX
OT Security & Digitalization Specialist
Henkel