CUF TD Module Engineer

Intel

1 month ago

3.7 on Glassdoor

Kulim, Malaysia

Onsite

Full Time

Senior

0 applicants

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About this role

This role involves developing and optimizing assembly processes and equipment for semiconductor packaging technology at Intel. It requires applying innovative concepts and ensuring manufacturability, quality, and reliability of packaging solutions, with a focus on continuous process improvements and collaboration with suppliers.

Skills

Qualifications

MSc in Mechanical Engineering, Material Engineering, Electrical Engineering, Chemical Engineering, Physics3+ years of experience

About Intel

intel.com

Intel Corporation is a global technology company that designs and manufactures advanced integrated digital technology products, including microprocessors, chipsets, and software solutions. With a focus on delivering Artificial Intelligence (AI) at scale, Intel provides comprehensive hardware and software solutions for cloud, data center, edge computing, and client devices. The company is known for its innovation in technologies that power a variety of computing platforms, from personal computers to enterprise solutions, enabling businesses and individuals to realize their full potential.

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