Micron Technology
As a Principal HBM Design Architecture Engineer at Micron, you will drive the exploration and definition of next-generation AI memory and system environments. You will analyze emerging infrastructure trends, build performance models, and develop tools that inform high-bandwidth memory architecture decisions and system-level trade-offs. The role involves close collaboration with architects and senior engineers to translate AI workload requirements into actionable memory subsystem strategies.
Micron Technology, Inc. is a global leader in semiconductors, specializing in the design and manufacturing of memory and storage solutions including DRAM, NAND flash, HBM, and SSDs. The company serves a broad range of markets including AI and data centers, automotive, mobile, client PC, and industrial IoT. Headquartered in Boise, Idaho, Micron is recognized for its technology leadership and ongoing U.S. manufacturing expansion.
Headquarters
San Francisco, CA
Company Size
201-500 employees
Founded
2018
Industry
Technology
Glassdoor Rating
4.2 / 5
Sarah Johnson
Chief Executive Officer
Michael Chen
Chief Technology Officer
Emily Williams
VP of Engineering
David Rodriguez
VP of Product
Jessica Thompson
Chief Financial Officer
Andrew Park
VP of Sales
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and employee contacts for Micron Technology.
Micron Technology didn’t post a salary, so this is our estimate from similar listings.
34% above the average for this role
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