Die Attach / Clip Attach (Solder) Engineer

The Die Attach / Clip Attach (Solder) Engineer is responsible for owning, developing, and sustaining the solder die attach and clip attach processes to ensure stable yields, high equipment uptime, and compliance with reliability and customer requirements. This role requires extensive semiconductor manufacturing experience, particularly in high-mix assembly and rigorous process controls, to support both new product introduction ramp and high-volume manufacturing. The position involves leading problem-solving initiatives, optimizing process parameters, and collaborating with cross-functional teams to achieve production and quality goals.