Direct Lid/Stiffener Attach Packaging Module Development Engineer

Intel

1 month ago

3.7 on Glassdoor

Kulim, Malaysia

Onsite

Full Time

Junior

0 applicants

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About this role

The role involves developing and optimizing assembly processes and equipment for semiconductor packaging at Intel, focusing on innovation, quality, reliability, and manufacturability. The position requires hands-on onsite work and collaboration with suppliers to meet product specifications and improve packaging technologies.

Skills

About Intel

intel.com

Intel Corporation is a global technology company that designs and manufactures advanced integrated digital technology products, including microprocessors, chipsets, and software solutions. With a focus on delivering Artificial Intelligence (AI) at scale, Intel provides comprehensive hardware and software solutions for cloud, data center, edge computing, and client devices. The company is known for its innovation in technologies that power a variety of computing platforms, from personal computers to enterprise solutions, enabling businesses and individuals to realize their full potential.

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