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© All Rights Reserved. ApplyBlast.com
Renesas 瑞萨电子
A Director of Advanced IC Packaging Development at Renesas leads the Next Generation Power Packaging roadmap, focusing on developing cutting-edge Smart Power Stages, Vertical Power Stages, Power Modules, and Wide Bandgap solutions. The role involves managing the entire lifecycle from R&D and NPI to global OSAT management.
作为全球领先的微控制器、模拟功率器件和SoC产品供应商，瑞萨电子通过提供可靠的创新嵌入式设计，与您共创无限未来。
Headquarters
San Francisco, CA
Company Size
201-500 employees
Founded
2018
Industry
Technology
Glassdoor Rating
4.2 / 5
Sarah Johnson
Chief Executive Officer
Michael Chen
Chief Technology Officer
Emily Williams
VP of Engineering
David Rodriguez
VP of Product
Jessica Thompson
Chief Financial Officer
Andrew Park
VP of Sales
View leadership team, funding history,
and employee contacts for Renesas 瑞萨电子.
8% above the average for this role