DMTS SiPh Packaging & Assembly Materials
GlobalFoundries(1 month ago)
About this role
GlobalFoundries is hiring a DMTS-grade technical leader to expand its Photonics platform into fully packaged electro-optical transceiver offerings using advanced 2.5D/3D co-packaged optics. The role sits within the Advanced Packaging and Photonics Center (APPC) and focuses on enabling next-generation optical interconnects and heterogeneous integration for AI, HPC, and data center applications. The position partners across internal teams and the OSAT ecosystem to support photonic/electrical packaging commercialization at scale.
Required Skills
- Silicon Photonics
- Advanced Packaging
- Co-Packaged Optics
- Product Definition
- Package Architecture
- Reliability Engineering
- Materials Selection
- Design Rules
- FMEA
- Test Methodology
+12 more
Qualifications
- MS
- PhD
About GlobalFoundries
gf.comGlobalFoundries is a leading semiconductor manufacturing firm that specializes in providing advanced technology solutions to a global clientele. The company facilitates seamless collaboration through its GF Connect platform, allowing customers to manage orders and get to production more efficiently. With a commitment to innovation and quality, GlobalFoundries plays a crucial role in the semiconductor supply chain, delivering cutting-edge manufacturing capabilities for various industries.
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