Electronics Packaging Engineer

The Fleet Ballistic Missile Avionics team is seeking an experienced Electronics Packaging Engineer to develop preliminary 3D concept models and advance space flight avionics hardware for flight use. The role involves designing electronic enclosures, coordinating with various engineering disciplines to ensure compliant designs, and supporting manufacturing and test processes. The position requires preparing fabrication documentation and working within an Integrated Product Team environment to deliver producible designs that meet technical, cost, and schedule requirements.