ENGINEER, High Bandwidth Memory (HBM) & New Product Introduction (NPI)
micron
About this role
Micron is seeking Engineers to join their Package Development Engineering Team for Advanced Packaging in Singapore, focusing on supporting next-generation memory and HBM packaging technologies, and facilitating the transition of new products from development to high-volume manufacturing.
Skills
Qualifications
About micron
micron.comMicron Technology, Inc. is a global leader in semiconductors. It provides a broad range of performance-enhancing memory and storage solutions. Headquartered in Boise, Idaho, Micron serves customers worldwide with its memory and storage products. The company is recognized for its global reach and leadership in the semiconductor industry.
About micron
Headquarters
San Francisco, CA
Company Size
201-500 employees
Founded
2018
Industry
Technology
Glassdoor Rating
4.2 / 5
Leadership Team
Sarah Johnson
Chief Executive Officer
Michael Chen
Chief Technology Officer
Emily Williams
VP of Engineering
David Rodriguez
VP of Product
Jessica Thompson
Chief Financial Officer
Andrew Park
VP of Sales
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and employee contacts for micron.
Salary
$52k – $88k
per year
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