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© All Rights Reserved. ApplyBlast.com
Coherent
This role involves leading the development of rapid IC packaging for individual die to support Failure Analysis and New Product Introduction tasks. The position requires planning and driving R&D with internal and external partners to establish advanced packaging processes that meet NPI goals for turnaround time, reliability, and chip-package interaction. The engineer will collaborate with IC and package design teams, process engineering, and external foundry and OSAT partners to develop and test required processes and tooling.
Headquarters
Saxonburg, Pennsylvania, United States
Company Size
10001+ employees
Founded
1971
Coherent is a global leader in lasers, photonics, engineered materials and networking technologies, providing lasers, optical components, subsystems and materials to industrial, communications, electronics and instrumentation markets. The company develops high‑performance laser systems and photonic solutions for applications such as materials processing, microelectronics, fiber‑optic communications, sensing and scientific research. Combining extensive R&D, global manufacturing and application engineering, Coherent delivers customized systems, components and support that enable customers’ breakthrough technologies worldwide.
Headquarters
San Francisco, CA
Company Size
201-500 employees
Founded
2018
Industry
Technology
Glassdoor Rating
4.2 / 5
Sarah Johnson
Chief Executive Officer
Michael Chen
Chief Technology Officer
Emily Williams
VP of Engineering
David Rodriguez
VP of Product
Jessica Thompson
Chief Financial Officer
Andrew Park
VP of Sales
View leadership team, funding history,
and employee contacts for Coherent.
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