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Engineering Technician IV (R&D 1st and 2nd Shift) at Applied Materials - ApplyBlast

Engineering Technician IV (R&D 1st and 2nd Shift)

Applied Materials

5 months ago

3.9 on Glassdoor

Austin, TX

Onsite

Full Time

Senior

0 applicants

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About this role

An Associate degree holder with 5–10 years of experience performs machine testing and maintenance on Ion Implanters and RF Plasma Systems at Applied Materials. The role involves troubleshooting equipment malfunctions, conducting preventive maintenance, and collaborating with engineers to optimize semiconductor manufacturing processes in a fast-paced Environment.

Responsibilities

Perform routine maintenance on semiconductor implant equipment to prevent downtime
Diagnose and troubleshoot equipment malfunctions using technical manuals and diagnostic tools
Conduct scheduled preventive maintenance including cleaning and part replacement
Collaborate with engineers to develop new equipment and optimize existing performance
Document all maintenance activities, repairs, and adjustments in detailed logs

Skills

Qualifications

Associate degree in electronicsAssociate degree in electrical engineeringAssociate degree in robotics

About Applied Materials

appliedmaterials.com

Headquarters

Santa Clara, California, United States

Company Size

10001+ employees

Founded

1967

View Profile

Applied Materials is a global leader in materials engineering solutions that enable the production of virtually every new semiconductor chip and advanced display. The company designs, manufactures and services equipment, software and process technologies across semiconductor fabrication (deposition, etch, implantation, inspection/metrology, CMP, ALD/CVD/PVD), advanced packaging and display manufacturing. Its customers include chipmakers, foundries and display manufacturers worldwide, and it provides process integration, factory automation and lifecycle services to improve yield, performance and cost. Headquartered in Santa Clara, California, Applied Materials combines deep R&D and scale to drive device scaling, energy efficiency and new architectures.