FA
Join Texas Instruments as a specialized Equipment Engineer to drive the digital transformation of Wire Bond and Die Attach lines through a critical MES implementation project. Following a brief orientation, you will lead equipment-specific workflows, integration, and validation efforts before transitioning into a production role focused on optimizing equipment uptime and automation. This position requires strong hands-on semiconductor equipment experience and expertise in MES platforms.
Headquarters
San Francisco, CA
Company Size
201-500 employees
Founded
2018
Industry
Technology
Glassdoor Rating
4.2 / 5
Sarah Johnson
Chief Executive Officer
Michael Chen
Chief Technology Officer
Emily Williams
VP of Engineering
David Rodriguez
VP of Product
Jessica Thompson
Chief Financial Officer
Andrew Park
VP of Sales
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