Foam Process Engineering Intern
HIC1002HSMC
About this role
Join HSM's Transportation & Specialty Mfg Division as a Process Engineering Intern to gain hands-on experience in a manufacturing environment, supporting the production of advanced materials in transportation applications. The role involves working alongside engineers to analyze processes, solve problems, and drive improvements on the production floor.
Skills
About HIC1002HSMC
hsi.usHirsch Solutions, USA is a premier provider of apparel decoration solutions. They offer equipment, software, and events for embroidery, DTG, and DTF, helping businesses scale their production and capabilities. As a top-tier US supplier, Hirsch Solutions delivers a comprehensive suite of tools and resources to streamline garment decoration workflows. Their focus on events, software, and equipment positions them as a go-to partner for professionals in the embroidery and print-on-demand space.
About HIC1002HSMC
Headquarters
San Francisco, CA
Company Size
201-500 employees
Founded
2018
Industry
Technology
Glassdoor Rating
4.2 / 5
Leadership Team
Sarah Johnson
Chief Executive Officer
Michael Chen
Chief Technology Officer
Emily Williams
VP of Engineering
David Rodriguez
VP of Product
Jessica Thompson
Chief Financial Officer
Andrew Park
VP of Sales
Unlock Company Insights
View leadership team, funding history,
and employee contacts for HIC1002HSMC.
Salary
$6k – $9k
per year
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