Group Leader – SMT

The Group Leader – SMT leads the development, optimization, and qualification of surface mount technology processes for advanced semiconductor assembly, focusing on print transfer efficiency, placement accuracy, and high manufacturing yield. This role involves establishing a scalable SMT module for SiP, AiP, and CSP product families while managing cross-functional engineering activities and team development. The position requires defining process windows, owning equipment qualification, and driving continuous improvements to enhance process robustness and yield.