Micron Technology
This role focuses on developing and optimizing HBM assembly and packaging processes to meet manufacturing targets while driving yield improvement and defect reduction. The engineer will analyze process data using statistical and AI-enabled tools to enhance troubleshooting efficiency and support new product ramp initiatives. Collaboration with cross-functional teams is essential to resolve technical challenges and ensure compliance with manufacturing standards.
Micron Technology, Inc. is a global leader in semiconductors, specializing in the design and manufacturing of memory and storage solutions including DRAM, NAND flash, HBM, and SSDs. The company serves a broad range of markets including AI and data centers, automotive, mobile, client PC, and industrial IoT. Headquartered in Boise, Idaho, Micron is recognized for its technology leadership and ongoing U.S. manufacturing expansion.
Headquarters
San Francisco, CA
Company Size
201-500 employees
Founded
2018
Industry
Technology
Glassdoor Rating
4.2 / 5
Sarah Johnson
Chief Executive Officer
Michael Chen
Chief Technology Officer
Emily Williams
VP of Engineering
David Rodriguez
VP of Product
Jessica Thompson
Chief Financial Officer
Andrew Park
VP of Sales
View leadership team, funding history,
and employee contacts for Micron Technology.
Micron Technology didn’t post a salary, so this is our estimate from similar listings.
30% above the average for this role
Senior Process Engineer - Semiconductor Assembly & Packaging
Talent Solutions
Manager, Semiconductor IC Packaging & Assembly Engineering
Renesas 瑞萨电子
Manager, HBM Product Development
Coherent
Manager, HBM Product Development
NVIDIA
NPI Engineer (Assembly Packaging)
Oracle
ADVANCED PACKAGING TD - SR ENGINEER PROCESS INTEGRATION
Eightfold