Micron Technology
The HBM Design Architecture Intern supports early-stage research, performance modeling, and tool development to guide future HBM architectural decisions. This role provides hands-on exposure to AI system trends and memory subsystem analysis while working closely with senior engineers and technical mentors. The position involves analyzing emerging compute and storage trends to understand evolving AI workloads and their impact on memory systems.
Micron Technology, Inc. is a global leader in semiconductors, specializing in the design and manufacturing of memory and storage solutions including DRAM, NAND flash, HBM, and SSDs. The company serves a broad range of markets including AI and data centers, automotive, mobile, client PC, and industrial IoT. Headquartered in Boise, Idaho, Micron is recognized for its technology leadership and ongoing U.S. manufacturing expansion.
Headquarters
San Francisco, CA
Company Size
201-500 employees
Founded
2018
Industry
Technology
Glassdoor Rating
4.2 / 5
Sarah Johnson
Chief Executive Officer
Michael Chen
Chief Technology Officer
Emily Williams
VP of Engineering
David Rodriguez
VP of Product
Jessica Thompson
Chief Financial Officer
Andrew Park
VP of Sales
View leadership team, funding history,
and employee contacts for Micron Technology.
Micron Technology didn’t post a salary, so this is our estimate from similar listings.
38% below the average for this role
HBM Memory Subsystem Architect – MTS/SMTS/DMTS
Eightfold
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