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© All Rights Reserved. ApplyBlast.com
Micron Technology
The HBM Design Engineer Intern at Micron Technology works within the High Bandwidth Memory Design team to support the development of industry-leading memory solutions for AI and high-performance computing applications. The role involves hands-on experience in semiconductor design, simulation, verification, and analysis using industry-standard tools and methodologies. Interns will collaborate with global engineering teams to improve design productivity and quality through AI-assisted workflows and cross-functional technical reviews.
Micron Technology, Inc. is a global leader in semiconductors, specializing in the design and manufacturing of memory and storage solutions including DRAM, NAND flash, HBM, and SSDs. The company serves a broad range of markets including AI and data centers, automotive, mobile, client PC, and industrial IoT. Headquartered in Boise, Idaho, Micron is recognized for its technology leadership and ongoing U.S. manufacturing expansion.
Headquarters
San Francisco, CA
Company Size
201-500 employees
Founded
2018
Industry
Technology
Glassdoor Rating
4.2 / 5
Sarah Johnson
Chief Executive Officer
Michael Chen
Chief Technology Officer
Emily Williams
VP of Engineering
David Rodriguez
VP of Product
Jessica Thompson
Chief Financial Officer
Andrew Park
VP of Sales
View leadership team, funding history,
and employee contacts for Micron Technology.