Micron Technology
The HBM IO Design Architecture Engineer is responsible for building and owning the end-to-end design quality system for High Bandwidth Memory products, ensuring silicon learnings are systematically captured and fed back into future designs. This role involves defining standardized IO design quality processes, correlating silicon measurements with simulation performance, and leveraging AI-driven analytics to accelerate root cause identification. The position requires collaboration across cross-functional teams to drive innovation and standardization in high-speed IO design architecture.
Micron Technology, Inc. is a global leader in semiconductors, specializing in the design and manufacturing of memory and storage solutions including DRAM, NAND flash, HBM, and SSDs. The company serves a broad range of markets including AI and data centers, automotive, mobile, client PC, and industrial IoT. Headquartered in Boise, Idaho, Micron is recognized for its technology leadership and ongoing U.S. manufacturing expansion.
Headquarters
San Francisco, CA
Company Size
201-500 employees
Founded
2018
Industry
Technology
Glassdoor Rating
4.2 / 5
Sarah Johnson
Chief Executive Officer
Michael Chen
Chief Technology Officer
Emily Williams
VP of Engineering
David Rodriguez
VP of Product
Jessica Thompson
Chief Financial Officer
Andrew Park
VP of Sales
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