Micron Technology
The HBM Platform Architecture Intern role involves contributing to the development of future High Bandwidth Memory platforms by evaluating electrical, thermal, and power delivery architectures. The intern will work alongside experienced architects to analyze design trade-offs, develop modeling tools, and investigate solutions that improve performance, power efficiency, reliability, and scalability for next-generation memory products. This position supports AI, high-performance computing, and data center applications through system optimization and innovation.
Micron Technology, Inc. is a global leader in semiconductors, specializing in the design and manufacturing of memory and storage solutions including DRAM, NAND flash, HBM, and SSDs. The company serves a broad range of markets including AI and data centers, automotive, mobile, client PC, and industrial IoT. Headquartered in Boise, Idaho, Micron is recognized for its technology leadership and ongoing U.S. manufacturing expansion.
Headquarters
San Francisco, CA
Company Size
201-500 employees
Founded
2018
Industry
Technology
Glassdoor Rating
4.2 / 5
Sarah Johnson
Chief Executive Officer
Michael Chen
Chief Technology Officer
Emily Williams
VP of Engineering
David Rodriguez
VP of Product
Jessica Thompson
Chief Financial Officer
Andrew Park
VP of Sales
View leadership team, funding history,
and employee contacts for Micron Technology.
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