viaPhoton
This role involves advancing the development of 200G+ systems and interfaces for next-generation Co-Packaged Optics products, owning the high-speed electrical data path from concept to production. The position requires deep, hands-on signal and power integrity work at the cutting edge of AI data center connectivity while guiding and mentoring junior engineers. The engineer will define PCB material selections, evaluate performance metrics, and assess host and optical technologies to productize cutting-edge solutions.
Reimagined Fiber Solutions For A More Connected World
Headquarters
San Francisco, CA
Company Size
201-500 employees
Founded
2018
Industry
Technology
Glassdoor Rating
4.2 / 5
Sarah Johnson
Chief Executive Officer
Michael Chen
Chief Technology Officer
Emily Williams
VP of Engineering
David Rodriguez
VP of Product
Jessica Thompson
Chief Financial Officer
Andrew Park
VP of Sales
View leadership team, funding history,
and employee contacts for viaPhoton.
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