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Hybrid Bonding Technology Process Development Engineer Entry Level Singapore Sgp at Applied Materials - ApplyBlast

Hybrid Bonding Technology Process Development Engineer Entry Level Singapore Sgp

Applied Materials

7 months ago

3.9 on Glassdoor

Singapore

Onsite

Full Time

Senior

0 applicants

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About this role

The Hybrid Bonding Process Development Engineer will develop and optimize pretreatment processes for hybrid bonding applications, collaborate with partners, prototype next-generation modules, and guide technical teams. The role offers hands-on training with state-of-the-art equipment in a cutting-edge research environment focused on advanced wafer-level packaging technologies.

Skills

Qualifications

Doctorate Degree

About Applied Materials

appliedmaterials.com

Headquarters

Santa Clara, California, United States

Company Size

10001+ employees

Founded

1967

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Applied Materials is a global leader in materials engineering solutions that enable the production of virtually every new semiconductor chip and advanced display. The company designs, manufactures and services equipment, software and process technologies across semiconductor fabrication (deposition, etch, implantation, inspection/metrology, CMP, ALD/CVD/PVD), advanced packaging and display manufacturing. Its customers include chipmakers, foundries and display manufacturers worldwide, and it provides process integration, factory automation and lifecycle services to improve yield, performance and cost. Headquartered in Santa Clara, California, Applied Materials combines deep R&D and scale to drive device scaling, energy efficiency and new architectures.