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IC Package Design Project Manager at Broadcom - ApplyBlast

IC Package Design Project Manager

Broadcom

1 month ago

3.3 on Glassdoor

Fort Collins, Colorado, United States

Onsite

Full Time

Senior

0 applicants

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About this role

Broadcom is seeking an experienced IC Package Design Project Manager to lead a team of engineers designing complex flip-chip-BGA packages for industry-leading ASICs. The role involves supporting the engineering team with project management, creating technical methodologies, and collaborating with global teams to develop high-performance package designs for AI, networking, and 5G applications. This is an on-site position requiring strong organizational and technical understanding of package design lifecycles.

Responsibilities

Lead team designing complex flip-chip-BGA packages for high-speed ASICs
Create and track project plans for 20+ concurrent designs
Develop technical methodologies and steering package technology design rules

Skills

About Broadcom

broadcom.com

Headquarters

Palo Alto, California, United States

Company Size

10001+ employees

Founded

1991

View Profile

Broadcom Inc. is a global technology leader that designs, develops, and supplies a comprehensive range of semiconductor and enterprise software solutions. The company's offerings include a variety of security solutions and products aimed at enhancing connectivity across various sectors. With a commitment to innovation and quality, Broadcom is at the forefront of driving technological advancements that connect everything, from data centers to mobile devices.