IC Package Mechanical FEA Engineer (R&D)
France Cars SAS AAA(2 months ago)
About this role
Broadcom is hiring an experienced Package Mechanical FEA Engineer to support the development of very large and complex ASIC packages used in AI, networking, HPC, and 5G applications. The role sits within a global R&D organization focused on high-performance and emerging packaging integration technologies, including advanced multi-chip modules and 3D integration approaches. You will interface with cross-functional partners to help shape mechanical package solutions for next-generation ASIC platforms.
Required Skills
- FEA Modeling
- Mechanical Design
- ASIC Packaging
- Package Integration
- Reliability Analysis
- Warpage Analysis
- Stress Analysis
- Mechanical Testing
- Model Calibration
- Design Validation
+9 more
Qualifications
- BS in Mechanical Engineering
- MS in Mechanical Engineering
- PhD in Mechanical Engineering
About France Cars SAS AAA
bloomberg.comBloomberg is a global leader in financial information and technology, providing data, news, and analytics to financial professionals around the world. The company offers an array of products and services, including the Bloomberg Terminal, which delivers real-time data and insights for trading, investment, and risk management. With a commitment to innovation, Bloomberg combines cutting-edge technology with extensive market expertise to empower financial professionals in making informed decisions.
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