IC Package Mechanical FEA Engineer (R&D)
Broadcom
About this role
Broadcom is hiring an experienced Package Mechanical FEA Engineer to support the development of very large and complex ASIC packages used in AI, networking, HPC, and 5G applications. The role sits within a global R&D organization focused on high-performance and emerging packaging integration technologies, including advanced multi-chip modules and 3D integration approaches. You will interface with cross-functional partners to help shape mechanical package solutions for next-generation ASIC platforms.
Skills
Qualifications
About Broadcom
broadcom.comBroadcom Inc. is a global technology leader that designs, develops, and supplies a comprehensive range of semiconductor and enterprise software solutions. The company's offerings include a variety of security solutions and products aimed at enhancing connectivity across various sectors. With a commitment to innovation and quality, Broadcom is at the forefront of driving technological advancements that connect everything, from data centers to mobile devices.
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About Broadcom
Headquarters
San Francisco, CA
Company Size
201-500 employees
Founded
2018
Industry
Technology
Glassdoor Rating
4.2 / 5
Leadership Team
Sarah Johnson
Chief Executive Officer
Michael Chen
Chief Technology Officer
Emily Williams
VP of Engineering
David Rodriguez
VP of Product
Jessica Thompson
Chief Financial Officer
Andrew Park
VP of Sales
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and employee contacts for Broadcom.
Salary
$127k – $203k
per year
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