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IC Substrate Manufacturing Engineer at Broadcom - ApplyBlast

IC Substrate Manufacturing Engineer

Broadcom

7 days ago

3.3 on Glassdoor

Hsinchu, Taiwan

Onsite

Full Time

Senior

0 applicants

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About this role

This role involves managing and resolving issues related to packaging, manufacturing, yield, quality, and delivery of high-volume semiconductor devices in collaboration with subcontractors. The position requires leading new product introduction activities, driving process improvements, and supporting production engineering for IC substrate manufacturing. The engineer will work with cross-functional teams to develop packaging technologies and ensure manufacturing maturity.

Responsibilities

Manage and resolve issues with IC substrate subcontractors
Drive NPI activity and process improvement for high volume manufacturing
Coordinate cross-functional engineering teams to resolve manufacturing issues

Skills

Qualifications

Bachelor Degree in an engineering discipline (Mechanical, Manufacturing, Material Science, Chemical or Electrical)

About Broadcom

broadcom.com

Headquarters

Palo Alto, California, United States

Company Size

10001+ employees

Founded

1991

View Profile

Broadcom Inc. is a global technology leader that designs, develops, and supplies a comprehensive range of semiconductor and enterprise software solutions. The company's offerings include a variety of security solutions and products aimed at enhancing connectivity across various sectors. With a commitment to innovation and quality, Broadcom is at the forefront of driving technological advancements that connect everything, from data centers to mobile devices.