Micron Technology
This role involves owning and delivering critical HBM IO blocks and subsystems from architectural definition through post-silicon debug, including interfaces for future CPO systems. The position requires defining HBM PHY, controller-to-PHY, and die-to-die requirements while leading architecture and design of analog, mixed-signal, and digital interface functions. The successful candidate will serve as a technical project lead, coordinating execution across multidisciplinary teams and mentoring engineers to improve build methods and execution rigor.
Micron Technology, Inc. is a global leader in semiconductors, specializing in the design and manufacturing of memory and storage solutions including DRAM, NAND flash, HBM, and SSDs. The company serves a broad range of markets including AI and data centers, automotive, mobile, client PC, and industrial IoT. Headquartered in Boise, Idaho, Micron is recognized for its technology leadership and ongoing U.S. manufacturing expansion.
Headquarters
San Francisco, CA
Company Size
201-500 employees
Founded
2018
Industry
Technology
Glassdoor Rating
4.2 / 5
Sarah Johnson
Chief Executive Officer
Michael Chen
Chief Technology Officer
Emily Williams
VP of Engineering
David Rodriguez
VP of Product
Jessica Thompson
Chief Financial Officer
Andrew Park
VP of Sales
View leadership team, funding history,
and employee contacts for Micron Technology.
Micron Technology didn’t post a salary, so this is our estimate from similar listings.
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