Micron Technology
This is an advanced internship role focused on evaluating and analyzing semiconductor packaging technologies, specifically for High Bandwidth Memory development. The intern will apply data-driven engineering methodologies, such as design of experiments, to study technology readiness and performance while collaborating across cross-functional teams.
Micron Technology, Inc. is a global leader in semiconductors, specializing in the design and manufacturing of memory and storage solutions including DRAM, NAND flash, HBM, and SSDs. The company serves a broad range of markets including AI and data centers, automotive, mobile, client PC, and industrial IoT. Headquartered in Boise, Idaho, Micron is recognized for its technology leadership and ongoing U.S. manufacturing expansion.
Headquarters
San Francisco, CA
Company Size
201-500 employees
Founded
2018
Industry
Technology
Glassdoor Rating
4.2 / 5
Sarah Johnson
Chief Executive Officer
Michael Chen
Chief Technology Officer
Emily Williams
VP of Engineering
David Rodriguez
VP of Product
Jessica Thompson
Chief Financial Officer
Andrew Park
VP of Sales
View leadership team, funding history,
and employee contacts for Micron Technology.
Micron Technology didn’t post a salary, so this is our estimate from similar listings.
Director Product Management - Custom High Bandwidth Memory (HBM)
Marvell Technology
Senior Manager, Memory Sales
Samsung Semiconductor Global Newsroom
Principal Process Engineer, Advanced Packaging
ASM
Intern, Package/Interposer Design (Summer 2026)
SK hynix
Director, System in Package Architecture
skhynixamerica.com
Memory Device Solutions Leader
Entegris