Intern - Process Engineer
Eightfold(5 months ago)
About this role
Micron MSB is seeking a passionate and driven intern to join our Assembly Process Engineering team, offering hands-on exposure to advanced semiconductor packaging processes. The internship will focus on Flip Chip Attach and Underfill technologies, allowing the intern to be involved in process development and yield improvement initiatives.
Required Skills
- Flip Chip Attach
- Underfill
- Statistics
- AI Programming
- Process Analysis
Qualifications
- Degree in Mechanical Engineering
- Degree in Chemical Engineering
- Degree in Material Science Engineering
About Eightfold
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