Intern - Product Integration Engineer (PIE) YE

This capstone project involves analyzing end-to-end Physical Failure Analysis (PFA) workflows for 3D-NAND devices to identify cycle-time bottlenecks and AI automation opportunities. Students will gain hands-on experience using tools like Scanning Electron Microscopy and Focused Ion Beam to resolve real manufacturing cases and improve yield learning efficiency. The role focuses on experimental learning, problem-solving, and designing controlled experiments to validate improvements in semiconductor fabrication processes.