Internship - IC Packaging Design
NXP Semiconductors(1 month ago)
About this role
A 6-month full-time internship within NXP's Packaging Innovation Design Group focused on semiconductor package design tool and methodology initiatives. The position is based in the Netherlands and offers experience working with global, multidisciplinary teams and the possibility to pursue a thesis/graduation project.
Required Skills
- Package Design
- Wire-Bond
- Flip Chip
- Cadence
- Allegro
- AutoCAD
- Python
- SKILL
- RAVEL
- VBA
+11 more
Qualifications
- Bachelor's or Master's Student in Electrical Engineering or Computer Science
- Registered Student Status
About NXP Semiconductors
nxp.comNXP is a global semiconductor company creating solutions that enable secure connections for a smarter world.
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