Internship - Package Electrical Modeling
NXP Semiconductors(2 months ago)
About this role
An internship for a Master’s Electrical Engineering student within NXP’s Package Innovation group in Nijmegen, focused on electrical modeling and RF lab measurements for advanced semiconductor packaging. The role offers hands-on experience contributing to NXP’s packaging solutions, with opportunities for personal development, thesis work, and potential conversion to a full-time position.
Required Skills
- Electrical Modeling
- RF Measurements
- Electromagnetics
- CAD Design
- Linux
- Excel
- Simulation
- Test Design
- De-embedding
- Material Characterization
Qualifications
- Master's Degree (in progress)
About NXP Semiconductors
nxp.comNXP is a global semiconductor company creating solutions that enable secure connections for a smarter world.
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