Internship-Thermal Management Materials and Solution Development

The Thermal Management Group in the Helsinki Hardware and System Lab at the Huawei Finland Research Center develops innovative solutions to address thermal challenges in advanced electronic devices. The intern will support projects related to thermal-management materials and solution development for compact electronic devices, including hands-on laboratory experiments, material preparation, prototype testing, data analysis, and technical reporting. This role is suitable for a Master or PhD student or early-career researcher with a background in materials science, chemistry, chemical engineering, mechanical engineering, thermal engineering, applied physics, or a related field.