Boyd
The Junior Thermal Research Engineer supports the design, modeling, and experimental validation of advanced thermal management systems for next-generation electronics cooling applications in data center, semiconductor, and aerospace sectors. This role focuses on thermal-fluid system modeling, data-driven engineering, and product development to accelerate design optimization and system-level performance prediction. The position involves working within a multidisciplinary team to develop innovative thermal solutions and test methodologies for high-performance electronics.
Headquarters
Pleasanton, California, United States
Company Size
5001-10000 employees
Founded
1928
Boyd is a global engineering company that designs and manufactures engineered material and thermal management technologies to seal, cool, protect, and insulate critical applications across diverse industries. Its product portfolio spans gaskets and sealing solutions, thermal interface materials, graphite heat spreaders, bonding and adhesive systems, insulation, and shielding, serving markets such as data centers, medical, eMobility, semiconductor, and aerospace and defense. Boyd partners with customers from concept through high-volume production, combining advanced material science with deep engineering expertise to enable innovation in cutting-edge applications.
Boyd didn’t post a salary, so this is our estimate from similar listings.
60% above the average for this role