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© All Rights Reserved. ApplyBlast.com
Oracle
The Lead Engineer, Chip-on-Carrier Design & Assembly Processes at Coherent drives process development for semiconductor and optoelectronic assembly technologies, transitioning new innovations from R&D into pilot and early-stage production. This hands-on role involves optimizing chip-on-carrier designs, wire bonding, and die attach processes while collaborating with cross-functional teams to ensure robust and scalable manufacturing solutions. The position requires strong technical expertise and practical experience in laboratory and cleanroom environments.
Oracle is a global technology company that builds database software, enterprise applications, and cloud infrastructure for businesses of all sizes. Its Oracle Cloud offers IaaS and PaaS along with a broad SaaS portfolio for ERP, HCM, and customer experience (CX). For marketers, Oracle provides data-driven marketing and social media tools (including Oracle Marketing Cloud/Eloqua and CX Marketing) to manage campaigns, personalization, and measurement across the customer journey. Organizations choose Oracle for its integrated data and analytics, enterprise-grade scalability, and global support for mission-critical deployments.
Headquarters
San Francisco, CA
Company Size
201-500 employees
Founded
2018
Industry
Technology
Glassdoor Rating
4.2 / 5
Sarah Johnson
Chief Executive Officer
Michael Chen
Chief Technology Officer
Emily Williams
VP of Engineering
David Rodriguez
VP of Product
Jessica Thompson
Chief Financial Officer
Andrew Park
VP of Sales
View leadership team, funding history,
and employee contacts for Oracle.
Oracle didn’t post a salary, so this is our estimate from similar listings.
Lead Engineer, Chip-on-Carrier Design & Assembly Processes
Oracle
Lead Engineer, Chip-on-Carrier Design & Assembly Processes
Coherent
Lead Engineer, Chip-on-Carrier Design & Assembly Processes
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