Lead Lead Frame and Packing Material development activities to ensure package requirements are met in terms of manufacturability, product qualification, reliability, quality, and cost. Serve as the technical expert for Lead Frame and Packing Material development within package development projects. Develop, define, and maintain Lead Frame and Packing Material designs, drawings, specifications, and design guidelines in compliance with assembly rules, manufacturing requirements, quality standards, and cost objectives. Collaborate with internal stakeholders, SQM, and suppliers on material design, specification development, material selection, qualification activities, FAI requirements, and qualification releases. Drive development, qualification, project milestone deliverables, and documentation releases, including specifications, drawings, GIMM, and related technical documents. Support incoming material quality management, material analysis, technical issue resolution, quality improvements, and continuous improvement initiatives in collaboration with suppliers and internal teams. Contribute to Lead Frame and Packing Material technology road mapping, UPEG activities, and material selection to support future technology and business requirements. Generate technical papers, journal publications, patents, and other technical contributions related to Lead Frame and package design. Engage with suppliers to evaluate emerging technologies, innovative materials, and cost-optimized design solutions that enhance technical capabilities and competitive advantage. Bachelor's Degree in Engineering (Semiconductor Technology, Microelectronics, Automation, Mechanical, Electrical, or Electronics Physics). Experience in Lead Frame design, Packing Material development, and qualification activities. Proficiency in drafting and designing Lead Frames using 2D and 3D design tools, including AutoCAD and Inventor. Knowledge of material physics and material properties related to Lead Frames and Packing Materials. Understanding of Geometric Dimensioning and Tolerancing (GD&T) and material specification development. Strong analytical and problem-solving skills. Knowledge of semiconductor packaging, assembly, and test processes. Experience in material development, analysis, qualification, and reliability evaluation. We are on a journey to create the best Infineon for everyone. We strive to create the best Infineon for everyone by embracing diversity and inclusion. We welcome applicants for who they are and offer a workplace built on trust, openness, respect and equal opportunity. Our hiring decisions are based on skills and experience. Even if you don't meet every requirement, we encourage you to apply. Please let your recruiter know if you need any accommodations during the interview process. Learn more about our various contact channels and about Diversity & Inclusion at Infineon.

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